PURPOSE: To realize bare chip mounting of a power IC feeding a high current to a semiconductor chip or a CPU including a semiconductor chip having high power consumption by providing means for bringing the surface of a semiconductor chip formed with no element to the ground potential of a printed board.

CONSTITUTION: A semiconductor chip A is a bare chip mounted on a printed board C with the element forming surface directing downward and then the semiconductor chip A is resin G molded to produce a semiconductor device. The semiconductor device is provided with means F, D for bringing the surface of the semiconductor chip A formed with no element to the ground potential of the printed board C. For example, the semiconductor A is surface mounted through At bumps B formed on a glass epoxy board C with the element forming surface directing downward. Furthermore, a conductor board F connects the GRD of the glass epoxy board through an Ag-Pb based paste with the surface of the semiconductor chip A formed with no element thus conducting the semiconductor chip A and the glass epoxy board C. Finally, the entirety is potting molded with resin G.