Title:
【発明の名称】試料処理方法
Document Type and Number:
Japanese Patent JP2695960
Kind Code:
B2
More Like This:
| JPH0714363 | [Name of invention] Plasma processing device |
| JPS56127773 | ETCHING DEVICE |
| JP2000269191 | PLASMA APPARATUS |
Inventors:
Kotaro Fujimoto
Yoshie Tanaka
Hironobu Kawahara
Yoshiaki Sato
Yoshie Tanaka
Hironobu Kawahara
Yoshiaki Sato
Application Number:
JP5637890A
Publication Date:
January 14, 1998
Filing Date:
March 09, 1990
Export Citation:
Assignee:
株式会社日立製作所
日立テクノエンジニアリング株式会社
日立テクノエンジニアリング株式会社
International Classes:
C23F4/00; H01L21/302; H01L21/3065; H01L21/3205; H01L21/3213; (IPC1-7): H01L21/3065
Domestic Patent References:
| JP5713743A | ||||
| JP63125685A | ||||
| JP63245926A | ||||
| JP6190445A | ||||
| JP6258636A | ||||
| JP5615044A | ||||
| JP6482550A | ||||
| JP57117241A |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)