PURPOSE: To test the electric characteristics of a semiconductor wafer efficiently by a method wherein the semiconductor wafer for a test device, a bump electrode, a lead-out electrode and a connection mechanism, with which the lead-out electrode is connected to a tester, are provided separately from the semiconductor wafer to be tested.

CONSTITUTION: A group of bump electrodes 22, formed on one side of a semiconductor wafer 21 for testing, are electrically connected to each electrode pad 13 of the circuit elements 12 of a semiconductor wafer W to be tested. The electric signals for measurement is outputted form the tester are simultaneously given to the circuit elements 12 of the semiconductor wafe W to be tested through the intermediary of a connection mechanism 32, a take-out electrode 23 and the bump electrode 22. Based on the above-mentioned electric signal, the response signal outputted from the prescribed electrode pad 13 of each circuit element 12 is given to a tester through the intermediary of the bump electrode 22, the take-out electrode 23 and the connection mechanism 32, and the electric characteristics of the circuit element 12 are collectively tested. As a result, the test of the electric characteristics of the semiconductor wafer W can be conducted efficiently.