Title:
【発明の名称】セグメントコンタクタ
Document Type and Number:
Japanese Patent JP2003506667
Kind Code:
A
Abstract:
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.
Inventors:
Esramy, Mohammad
Pedersen, David, Buoy
Cobb, Harley, Dee
Pedersen, David, Buoy
Cobb, Harley, Dee
Application Number:
JP2001501900A
Publication Date:
February 18, 2003
Filing Date:
June 06, 2000
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R3/00; G01R31/28; G01R1/073; H01L21/66; (IPC1-7): G01R1/073; H01L21/66
Domestic Patent References:
| JP2001524258A | 2001-11-27 | |||
| JPH06188299A | 1994-07-08 | |||
| JPH09105761A | 1997-04-22 | |||
| JPH1187442A | 1999-03-30 | |||
| JPH09274055A | 1997-10-21 | |||
| JPH03218472A | 1991-09-26 | |||
| JPH06222081A | 1994-08-12 | |||
| JPH02210269A | 1990-08-21 |
Foreign References:
| WO1996038858A2 | 1996-12-05 |
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)