Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2547538
Kind Code:
B2
Inventors:
SATO TAKEHISA
Application Number:
JP8482885A
Publication Date:
October 23, 1996
Filing Date:
April 19, 1985
Export Citation:
Assignee:
SANYO DENKI KK
International Classes:
H01L23/12; H01L23/04; H01L23/057; H01L23/48; H01L23/495; H01L23/50; H05K1/18; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)