Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2569032
Kind Code:
B2
Inventors:
Kobayashi Masayoshi
Akihisa Terano
Akihisa Terano
Application Number:
JP481887A
Publication Date:
January 08, 1997
Filing Date:
January 14, 1987
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/28; H01L21/3205; H01L23/52; (IPC1-7): H01L21/28; H01L21/3205
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)