Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2587043
Kind Code:
B2
Inventors:
OKUDA SATOSHI
Application Number:
JP31246186A
Publication Date:
March 05, 1997
Filing Date:
December 26, 1986
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/29; C08G59/00; C08G59/14; C08G59/50; C08G59/62; C08K7/16; C08L63/00; H01L23/31; (IPC1-7): H01L23/29; C08G59/14; C08K7/16; C08L63/00
Domestic Patent References:
| JP58138740A | ||||
| JP62280215A | ||||
| JP6317927A | ||||
| JP62260817A | ||||
| JP6317928A | ||||
| JP63128020A |
Attorney, Agent or Firm:
Nishihiko Yasuhiko