Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2845469
Kind Code:
B2
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Inventors:
SATSUMA KAZUMASA
Application Number:
JP903789A
Publication Date:
January 13, 1999
Filing Date:
January 18, 1989
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
H01L29/73; H01L21/331; H01L21/8222; H01L21/8249; H01L27/06; H01L27/08; H01L29/732; H01L29/78; (IPC1-7): H01L29/78; H01L21/8249; H01L27/06; H01L27/08
Domestic Patent References:
| JP6457756A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)