Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3342845
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor chip which can exhibit stable element characteristics by preventing the deformation caused by stresses, etc. SOLUTION: On the surface 21 of a sub chip 2, a plurality of prism-like functional bumps BF2 are arranged along the peripheral edge of the surface 21 so as to surround an active area 22 set up at the center of the surface 21. On the active area 22, on the other hand, one dummy bump BD2 having a rectangular planar shape is arranged. The dummy bump BD2 is formed in such a size that covers an almost whole area of the active area 22 in the top view and the area of the top face of the bump BD2 is made larger than those of the functional bumps BF2. In addition, the height of the dummy bump BD2 are made nearly equal to the heights of the functional bumps BF2.
Inventors:
Junichi Hikita
Kazutaka Shibata
Shigeyuki Ueda
Kazutaka Shibata
Shigeyuki Ueda
Application Number:
JP5121299A
Publication Date:
November 11, 2002
Filing Date:
February 26, 1999
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/18; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP5348469A | ||||
| JP5891646A | ||||
| JP61125141A | ||||
| JP8139096A | ||||
| JP10270637A |
Attorney, Agent or Firm:
Kousaku Inaoka (2 outside)