PURPOSE: To reduce the bends of semiconductor chips and eliminate the generations of voids and chip-cracks, by using a conductive bonding sheet containing a specific polyimide resin.

CONSTITUTION: In a polyimide resin represented by the formula I, R1 in the formula I represents a tetravalent organic acid residue, and in all the constituent acid components of R1, the one component not less than 50mol% is biphenylethertetracarboxylic acid. Also, R2 represents a divalent diamino-acid residue, and in all the constituent diamine component of R2, the components of 50-99mol% are diamine compounds, and further, the one component of 1-50mol% is diamino- siloxane represented by the formula II (in the formula II, each of R3, R4 represents a divalent organic residue, and each of R5-R8 represents 1-6C hydrocarbon, and further, n represents zero or a positive integer not larger than 12). In a manufacturing method for semiconductor devices, a conductive bonding sheet is so created that the polyimide resin, a high-molecular-weight rubber having a weight-average molecular weight not smaller than 10000, and a conductive bonding agent having a conductive powder as its essential component are fixed together in a peel-able way on a supporting film. Subsequently, by the use of this conductive bonding sheet, the replications of semiconductor chips are performed, and then, this sheet is fixed in a bonding way on a lead frame.