Title:
【発明の名称】半導体素子
Document Type and Number:
Japanese Patent JPS603776
Kind Code:
B2
Abstract:
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.
Inventors:
KUNYA KEIICHI
ARAKAWA HIDEO
MAEDA KUNIHIRO
MORITA KEIICHI
ARAKAWA HIDEO
MAEDA KUNIHIRO
MORITA KEIICHI
Application Number:
JP6472077A
Publication Date:
January 30, 1985
Filing Date:
June 03, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C22C49/00; H01L21/52; H01L21/58; H01L23/051; H01L23/373; H01L23/492; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Ogawa Katsuo
Next Patent: JPS603777