Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2510535
Kind Code:
B2
Inventors:
HATANAKA NORIAKI
IWABUCHI KYOMI
HIRAI TOMOAKI
YOSHINAGA MAKI
AOI MOTOI
IWABUCHI KYOMI
HIRAI TOMOAKI
YOSHINAGA MAKI
AOI MOTOI
Application Number:
JP24290886A
Publication Date:
June 26, 1996
Filing Date:
October 15, 1986
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G05F3/22; H03F3/34; H03F3/343; H03F3/45; (IPC1-7): H03F3/343; G05F3/22; H03F3/45
Domestic Patent References:
| JP58134519A | ||||
| JP62173807A | ||||
| JP57123707A | ||||
| JP5967018U |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)