Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2607301
Kind Code:
B2
Inventors:
Ikuo Yasui
Visit Tohru
Visit Tohru
Application Number:
JP13942590A
Publication Date:
May 07, 1997
Filing Date:
May 29, 1990
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G06J1/00; H03M1/12; (IPC1-7): G06J1/00; H03M1/12
Domestic Patent References:
| JP115912B2 |
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)