Title:
【発明の名称】半導体製造装置
Document Type and Number:
Japanese Patent JP2668020
Kind Code:
B2
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Inventors:
Nakao Ken
Application Number:
JP22306088A
Publication Date:
October 27, 1997
Filing Date:
September 06, 1988
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/44; H01L21/205; H01L21/22; H01L21/31; H01L21/316; (IPC1-7): H01L21/22; C23C16/44; H01L21/205; H01L21/31; H01L21/316
Domestic Patent References:
JP1302816A | ||||
JP61242011A | ||||
JP62149841U |
Attorney, Agent or Firm:
Saichi Suyama (1 person outside)