Title:
【発明の名称】半導体マイクロアクチュエータ
Document Type and Number:
Japanese Patent JPH04506392
Kind Code:
A
Abstract:
A semiconductor microactuator has a silicon semiconductor substrate having suspension means connected thereto. The suspension means has a first layer of material having a first thermal expansion coefficient and a second layer of material having a second thermal expansion different than the first thermal expansion coefficient and may be a part of a diaphragm or a pair of connecting members. A movable element, which may be a second part of the diaphragm or a boss, is connected to the suspension to be displaced thereby as the temperature of the first and second layers of material is varied. The displacement is solely irrotational with respect to the semiconductor substrate.
Inventors:
German, John Hallock
Application Number:
JP50959990A
Publication Date:
November 05, 1992
Filing Date:
June 21, 1990
Export Citation:
Assignee:
IC Sensors, Inc.
International Classes:
F03G7/06; B81B3/00; F15C5/00; F16K99/00; G01B9/02; G02B26/00; (IPC1-7): F03G7/06; G01B9/02
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)