Title:
METAL BONDED DIAMOND POLISHING MATERIAL BLOCK
Document Type and Number:
Japanese Patent JPS5851076
Kind Code:
A
Abstract:
An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/copper alloy matrix which also contains a wetting agent for (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates.
Inventors:
SUTEFUAN CHIYAARUSU HAIDEN
Application Number:
JP13527782A
Publication Date:
March 25, 1983
Filing Date:
August 04, 1982
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
B24D3/06; B24D3/00; B24D3/34; C09K3/14; C22C26/00; (IPC1-7): B24D3/06
Domestic Patent References:
| JPS5474586A | 1979-06-14 | |||
| JPS55112772A | 1980-08-30 |
Attorney, Agent or Firm:
Tokunji Ikunuma