Title:
SOLVENT-FREE ULTRAVIOLET RAY NON-TACKIFIABLE B STAGE CURABLE EPOXY ADHESIVE
Document Type and Number:
Japanese Patent JPS5857482
Kind Code:
A
Abstract:
Disclosed is a solventless UV dryable B-stageable epoxy adhesive which comprises about 40 to about 70 pbw of a solid thermally curable epoxy having a molecular weight between about 650 and about 4000, a thermal curing agent for the thermally curable epoxy which is stable at room temperature and soluble on the adhesive in an amount of about stoichiometric to about 50% by weight in excess of stoichiometric, up to about 2 pbw of an accelerator for the thermal curing agent which is soluble in the adhesive, about 25 to about 60 pbw of a liquid UV curable resin having a molecular weight of less than about 700 which is either an epoxy, an acrylic, or a mixture thereof and which is a diluent for the thermally curable epoxy, about 1 to about 10 pbw of a UV photoinitiator for the UV curable resin, up to about 20 pbw of a reactive diluent, up to about 5 pbw of a flow control agent, up to about 1 pbw of a surfactant, and up to about 10 pbw of a tri or higher functional epoxy.
Inventors:
JIYOOJI DAGURASU DEIKUSON
NANSHII UUZUREI KAARUSON
HAWAADO EDOWAADO SOONDAASU
NANSHII UUZUREI KAARUSON
HAWAADO EDOWAADO SOONDAASU
Application Number:
JP15692082A
Publication Date:
April 05, 1983
Filing Date:
September 10, 1982
Export Citation:
Assignee:
WESTINGHOUSE ELECTRIC CORP
International Classes:
C08G59/18; C08J3/28; C09J163/00; (IPC1-7): C09J3/16
Attorney, Agent or Firm:
Soga Doteru