Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0655435
Kind Code:
A
Abstract:
PURPOSE: To prevent cracks and rough surface caused by lower surface polishing for a semiconductor substrate having bumps on its upper surface.
CONSTITUTION: A street 5 having a thickly applied adhesive film 4 contg. a thermosetting resin is papered on a resist film 3 provided on a surface contg. bumps 2. Ultraviolet rays are irradiated to harden the adhesive film 4, providing resiliency. This absorbs the projecting parts of the bumps to prevent cracks caused by polishing the lower surface of a substrate, improving mirror surface.
Inventors:
TERADA HITOSHI
Application Number:
JP20768192A
Publication Date:
March 01, 1994
Filing Date:
August 04, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
B24B37/04; B24B37/30; H01L21/304; H01L21/60; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)