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Title:
SOLID-STATE IMAGE PICKUP ELEMENT
Document Type and Number:
Japanese Patent JPS5910264
Kind Code:
A
Abstract:

PURPOSE: To enable the mass production easily with high yield by a method wherein mounting holes are formed by means of automatic working, on the basis of an image pickup pellet built-in on a package, by fixing a workable material at the part of providing the package mounting holes.

CONSTITUTION: The ceramic package 14 wherein synthetic resin member 13 is fixed at the part of arranging the package mounting holes is held and fixed to a chuck part 17. Positioning reference marks (registers) 16 and 16' on the pellet are image-formed by a camera optical system 18. The optical image is converted into a video signal, which is digitized in an image processing part 20, and thus converted into positional information by memory and calculation. The numerical control of the position of an XYZ table 23 is performed based on the obtained positional information, and then the package mounting holes 7a and 8a are formed accurately at the position calculated and determined.


Inventors:
HANNO TSUTOMU
KOMATANI MASATOSHI
Application Number:
JP11858582A
Publication Date:
January 19, 1984
Filing Date:
July 09, 1982
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L23/32; H01L27/14; H01L31/02; H04N5/335; (IPC1-7): H01L27/14; H01L31/02; H04N5/30
Attorney, Agent or Firm:
Toshiyuki Usuda



 
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