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Patent Searching and Data


Title:
BAND-FORM PACKAGE FOR FOOD UTENSIL
Document Type and Number:
Japanese Patent JPH0811934
Kind Code:
A
Abstract:

PURPOSE: To facilitate the pulling out of a utensil, and prevent a film flake from adhering to the utensil by a method wherein a sealing part wherein a perforation is provided between respective package units and between rows of the package units is adhesively bonded with an easily separatable adhesive, and at the same time, areas wherein a notch is formed when being cut off are provided on the perforation.

CONSTITUTION: A sealing part 3 is constituted between package units 2 for spoons 8, wherein a pair of band-form synthetic resin films 1 are overlapped and linked. Then, a perforation 4 is provided along the approx. center line of the films 1. Also, another perforation 9 is formed between rows of the package units. Then, sealing parts 5 at both ends of the package unit are adhered with an easily separatable adhesive. On the perforation 9 between the rows of the package units, areas 10 wherein a notch is formed when the rows are cut off from the perforation are formed. The area 10 is made into, e.g. a simple incision which is perpendicular to the perforation 9. As the result, the notches are formed only when the package unit is separated from a band-form package, and the package unit is not torn at random.


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Inventors:
INABA KOICHI
TSURITANI NAOMASA
Application Number:
JP16857794A
Publication Date:
January 16, 1996
Filing Date:
June 29, 1994
Export Citation:
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Assignee:
SANYO PACKS KK
YAKULT HONSHA KK
TOHO SHOJI KK
International Classes:
A47G21/04; A47G21/18; B65D75/42; B65D77/24; B65D85/00; (IPC1-7): B65D75/42; A47G21/04; A47G21/18; B65D85/00
Domestic Patent References:
JP3102468U2004-07-08
JPS53100369U1978-08-14
Attorney, Agent or Firm:
Kikuchi Takeshi