Title:
【発明の名称】基板移送装置
Document Type and Number:
Japanese Patent JP3377725
Kind Code:
B2
Abstract:
A substrate transporting device used in the process of manufacturing, for instance, semiconductor chips including a substrate guide comprised of a substrate guide rail which guides one side of each substrate and a substrate supporting plate which supports another side of the substrate, feeding claws for feeding a substrate to, for instance, a bonding position, the feeding claws being provided on a feeding claw holder and extending in the direction perpendicular to the substrate supporting plate, a claw X-direction feeder which moves the feeding claw holder in a direction in which the substrate is conveyed along the substrate guide, and a claw Y-direction feeder which moves the feeding claw holder in a direction perpendicular to the direction in which the substrate is conveyed along the substrate guide; thus, the substrates are conveyed one pitch at a time by means of a rectangular motion of the feeding claws on a horizontal plane effected by the claw X-direction feeder and the claw Y-direction feeder.
Inventors:
Hiroshi Ushiki
Tetsuya Kohara
Kazuo Sugiura
Tetsuya Kohara
Kazuo Sugiura
Application Number:
JP20742097A
Publication Date:
February 17, 2003
Filing Date:
July 17, 1997
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60; B65G25/08; H01L21/50; H01L21/677; H05K13/02; (IPC1-7): H01L21/50; B65G25/08; H01L21/60; H05K13/02
Domestic Patent References:
| JP964067A | ||||
| JP59223618A | ||||
| JP63178595A | ||||
| JP7302806A |
Attorney, Agent or Firm:
Yoshinori Tanabe