Title:
【発明の名称】電子部品搭載用基板
Document Type and Number:
Japanese Patent JP2946361
Kind Code:
B2
Inventors:
DEMURA AKIHIRO
Application Number:
JP15963991A
Publication Date:
September 06, 1999
Filing Date:
June 03, 1991
Export Citation:
Assignee:
IBIDEN KK
International Classes:
H01L23/12; H01L23/50; H05K1/11; H05K1/18; (IPC1-7): H01L23/50; H01L23/12