Title:
【発明の名称】半導体素子搭載用基板
Document Type and Number:
Japanese Patent JP2612455
Kind Code:
B2
Abstract:
PURPOSE:To obtain a semiconductor element mounting board with high heat dissipation at low costs by forming a metallic layer on the surface of a semiconductor element mounting part in a semiconductor element board having a metallic layer on the back side of the resin formed board, arranging a throughhole on the semiconductor element mounting part, and filling a solder in the throughhole. CONSTITUTION:A semiconductor element mounting board 10 is so constructed that a semiconductor element mounting part 12 and a conductive circuit 11 are formed atop the board consisting of an organic resin material 14. In such semiconductor element mounting board 10, a metallic layer 13a as well as a throughhole 15 are formed on the semiconductor element mounting part 12, the metallic layer 13a being in conduction with a metallic layer 13b on the back side of the board, or on the opposite surface of the semiconductor element mounting part 12, while the throughhole 15 being filled with a solder 16.
Inventors:
Naoto Ishida
Application Number:
JP24674287A
Publication Date:
May 21, 1997
Filing Date:
September 30, 1987
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L23/12; H01L23/14; H01L23/36; (IPC1-7): H01L23/12
Domestic Patent References:
| JP60111489A | ||||
| JP6287478U |
Attorney, Agent or Firm:
Hironori Takenori