Title:
【発明の名称】基板の処理システム及び処理方法
Document Type and Number:
Japanese Patent JP3336225
Kind Code:
B2
Inventors:
Osamu Kuroda
Application Number:
JP11878497A
Publication Date:
October 21, 2002
Filing Date:
April 21, 1997
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/677; H01L21/304; H01L21/68; (IPC1-7): H01L21/304; H01L21/68
Domestic Patent References:
| JP63184350A | ||||
| JP2184045A | ||||
| JP4169531A | ||||
| JP9115868A | ||||
| JP332418U |
Attorney, Agent or Firm:
Koji Hagiwara (2 outside)