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Patent Searching and Data


Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH06102410
Kind Code:
A
Abstract:

PURPOSE: To easily form a coating film excellen in precision and to use various materials excellent in heat resistance and solvent resistance by irradiating a material layer with excimer laser light to form a pattern from a transfer body.

CONSTITUTION: Silicone resin 2 for peeling is applied on a polyester film supporting body 1, on which a pattern forming material layer 3 containing coloring pigment dispersed in a thermosetting resin is formed. This pattern forming material layer 3 is irradiated with excimer laser light to form a pattern. The excimer laser uses mixture gas of rare gas Xe and halogen gas Cl2. Then the pattern forming material layer 3 is transferred through an adhesive layer to a transfer substate 7 having a black matrix 8 formed on the substrate. The black matrix 8 is formed by patterning a light-shielding material such as chromium by photolithography. The adhesive layer 9 is required to have tackiness and cohesive force for peeling the pattern forming material layer from the peeling layer 2 and is preferred to the layer having high adhesion strength, heat resistance and solvent resistance after transfer.


Inventors:
ISOMI AKIRA
HAGINO MASATO
Application Number:
JP25101792A
Publication Date:
April 15, 1994
Filing Date:
September 21, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B41M5/26; B41M5/382; G02B5/20; G03F7/20; G02F1/1335; (IPC1-7): G02B5/20; B41M5/26
Domestic Patent References:
JPS6199103A1986-05-17
JPS61256303A1986-11-13
JPS61279802A1986-12-10
JPS61105885A1986-05-23
JPH02232265A1990-09-14
JPS6196737A1986-05-15
JPH04139789A1992-05-13
Attorney, Agent or Firm:
Akira Kobiji (2 outside)