Title:
【発明の名称】タブテ-プボンディング装置
Document Type and Number:
Japanese Patent JP2617356
Kind Code:
B2
Abstract:
A tab tape bonder including a bonding device which bonds semiconductor chips, etc. to a tab tape, a first roller driver which feeds the tab tape into the bonding device, a detector which detects holes or perforations formed in the tab tape fed by the first roller driver, and a controller which controls the feeding pitch of the tab tape by the first roller driver in accordance with the detection results obtained by the detector.
Inventors:
Akihiro Nishimura
Koji Sato
Koji Sato
Application Number:
JP14304189A
Publication Date:
June 04, 1997
Filing Date:
June 07, 1989
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
C22C21/00; B65H20/04; B65H35/00; B65H37/04; H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63166238A |
Attorney, Agent or Firm:
Yoshinori Tanabe