Title:
【発明の名称】集積回路パッケージ用テストソケットおよびテスト治具
Document Type and Number:
Japanese Patent JP2882787
Kind Code:
B2
Abstract:
A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. An elastomeric diaphragm or spring is positioned between the lower housing and the load board and extends into the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. Electrically conductive cylindrical eyelets are positioned within the holes in the load board to guide the travel of the socket plungers and to transfer the test signals from the socket plungers to the load board.
Inventors:
MAAKU EE SUWAATO
Application Number:
JP10487598A
Publication Date:
April 12, 1999
Filing Date:
April 15, 1998
Export Citation:
Assignee:
EBERETSUTO CHAARUZU TEKUNOROJIIZU INC
International Classes:
G01R1/073; G01R31/02; H01L21/66; H01L21/822; G01R31/26; H01L23/32; H01L27/04; H01R12/71; H01R12/77; H01R33/76; (IPC1-7): H01R33/76; G01R31/26; H01L23/32
Domestic Patent References:
| JP8293372A | ||||
| JP8227770A | ||||
| JP8213088A | ||||
| JP883656A | ||||
| JP7272810A | ||||
| JP6258778U |
Attorney, Agent or Firm:
Takashi Ishida (4 others)