PURPOSE: To provide an adhesive capable of increasing the bonding strength between copper foil and prepreg by preparing a solution of thermosetting resin, thermoplastic resin and a specific amount of coupling agent that is inevitable.

CONSTITUTION: Thermosetting resin such as phenolic resin, thermoplastic resin such as butyral resin compatible with the thermosetting resin, and coupling agent such as vinyl triethoxy silane are dissolved in a solvent to prepare an adhesive for copper foil. The content of the coupling agent shall be 0.01 to 5% in order to obtain sufficient bonding strength. A copper-clad laminate using this adhesive is useful for manufacture of a reliable electronic device of safety.