Title:
【発明の名称】熱可塑性樹脂組成物
Document Type and Number:
Japanese Patent JPH0745621
Kind Code:
B2
Abstract:
PURPOSE:To provide the title compsn. which has excellent moldability and gives molded products excellent in flexibility, resistance to impact and chemicals and the uniformity and smoothness of the appearance, by blending a polyamide resin with a specified ethylene copolymer having acid anhydride groups. CONSTITUTION:50-90wt% ethylene (a) is copolymerized with 5-49wt% alkyl ester of a 3-8C alpha,beta-unsaturated carboxylic acid (b) [e.g., an alkyl (meth) acrylate] and 0.5-10wt% maleic anhdride (c) to obtain an ethylene copolymer (B) having a melt index of 0.1-200g/10min. 5-59wt% at least one polyamide resin (A) selected from the group consisting of polyamide 6, polyamide 66, polyamide 12, etc., is blended with 95-41wt% component B.
Inventors:
Kentaro Mashita
Minami Nanari
Ishii Shoji
Minami Nanari
Ishii Shoji
Application Number:
JP30482386A
Publication Date:
May 17, 1995
Filing Date:
December 19, 1986
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08L23/02; C08L23/00; C08L23/08; C08L33/00; C08L33/02; C08L77/00; C08L101/00; F26B13/10; F26B15/12; F26B25/00; (IPC1-7): C08L77/00; C08L23/08
Domestic Patent References:
| JP6069159A |
Attorney, Agent or Firm:
Mitsuhiro Moroishi (1 person outside)