Title:
【発明の名称】薄膜コイルおよび薄膜コイル実装モジュール
Document Type and Number:
Japanese Patent JP3383930
Kind Code:
B2
More Like This:
| JPS62202759 | PRODUCTION OF EXOTHERMIC RESISTANCE ELEMENT |
| JPS55133596 | MULTILAYER PRINTED THICK FILM BOARD |
Inventors:
Eishu Sugawara
Hidefumi Funaki
Hidefumi Funaki
Application Number:
JP31041294A
Publication Date:
March 10, 2003
Filing Date:
December 14, 1994
Export Citation:
Assignee:
NEC Tokin Co., Ltd.
International Classes:
H05K1/16; H01F17/00; H01R12/71; (IPC1-7): H01F17/00; H01R12/22; H05K1/16
Domestic Patent References:
| JP254903A | ||||
| JP59144204A | ||||
| JP61293011A |
Attorney, Agent or Firm:
Yosuke Goto (2 outside)