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Title:
MANUFACTURE OF WAFER TRANSFER FORK
Document Type and Number:
Japanese Patent JPH0786372
Kind Code:
A
Abstract:

PURPOSE: To firmly fix a support projection to a wafer transfer fork so as not to fall off by a method wherein the support projection is fastened to the transfer fork as it is screwed in a threaded hole provided to the wafer transfer fork cutting thread grooves in its peripheral surface.

CONSTITUTION: Support projections 5 of resin are provided to the upsides of the forked tips and the root of a wafer transfer fork 1, and a wafer is placed on the support projections 5. Threaded holes 7 whose diameter d is smaller than 1 that D of the support projection 5 are provided, and adhesive agent 8 is applied to the thread grooves of the threaded holes 7. When the support projection 5 is screwed in the threaded hole 7 conforming to the other projections in height, thread grooves are cut in the peripheral surface of the support projection 5 by the thread grooves of the threaded hole 7. Therefore, adhesive agent 8 is filled in the thread grooves of the threaded hole 7 and the support projection 5 to firmly fix the projection 5 to the threaded hole 7. Forcibly fed adhesive agent 8 is made to flow out to the end of the threaded hole 7 and the end face of the support projection 5 to bond them together.


Inventors:
SUZUKI TATSUO
HAGIO MITSUAKI
Application Number:
JP25238193A
Publication Date:
March 31, 1995
Filing Date:
September 14, 1993
Export Citation:
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Assignee:
YASKAWA ELECTRIC CORP
International Classes:
B65G49/07; C23C14/56; F16B21/00; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/07; C23C14/56



 
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