Title:
PROBER
Document Type and Number:
Japanese Patent JPH077054
Kind Code:
A
Abstract:
PURPOSE: To reduce the floor occupying area of a wafer prober and, at the same time, to simplify the holding mechanism of a test head.
CONSTITUTION: A semiconductor wafer 3 carried by means of a loader to a wafer chuck section 2 steeply inclined against the horizontal plane at an angle close to 90° is sucked and fixed to the section 2. Then a test head 5 is turned and a probe card 5b is brought into contact with the wafer 3 for electrical tests. After testing, the card 5b is moved by reversely turning the head 5 and the wafer 3 is housed in a wafer cassette by means of an unloader. A columnar wafer stopper 4 is provided at the bottom of the chuck section 2 to prevent the dropping of the wafer 2 from the section 2.
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Inventors:
ARIGA AKIHIKO
Application Number:
JP14493293A
Publication Date:
January 10, 1995
Filing Date:
June 16, 1993
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/66; G01R31/26; (IPC1-7): H01L21/66; G01R31/26
Attorney, Agent or Firm:
Yamato Tsutsui
Next Patent: PROBE DEVICE