Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH0641273
Kind Code:
A
Abstract:
PURPOSE: To obtain a cured product excellent in adhesiveness and heat resistance.
CONSTITUTION: The composition essentially consists of an epoxy resin prepared by glycidyl-etherifying at least 10% of the alcoholic hydroxyl groups of an adduct obtained by reacting an epoxy resin containing two glycidyl groups in the molecule with a compound containing two phenolic hydroxyl groups in the molecule and an epoxy resin containing at least three glycidyl groups in the molecule, a curing agent and a cure accelerator.
Inventors:
HAMAGUCHI MASAHIRO
MIZOGUCHI KENICHI
KUBOKI KENICHI
AKATSUKA YASUMASA
ISHII TOMIYOSHI
MIZOGUCHI KENICHI
KUBOKI KENICHI
AKATSUKA YASUMASA
ISHII TOMIYOSHI
Application Number:
JP21753492A
Publication Date:
February 15, 1994
Filing Date:
July 24, 1992
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/14; C08G59/00; C08G59/62; C08L63/00; (IPC1-7): C08G59/14; C08G59/62
Next Patent: PHOTOCROSSLINKED POLYESTER RESIN MOLDING