Title:
【発明の名称】ウェーハのノッチ部研磨装置
Document Type and Number:
Japanese Patent JP2832142
Kind Code:
B2
Abstract:
An apparatus (3) for polishing the notch (1) of a wafer (W) in an effective and efficient way, which comprises: a flexible tape (4) carrying abrasive grains (4c) in the working face thereof; an infeed reel (5) for feeding the tape (4) stored thereon: a take-up reel (6) for taking up the tape (4) fed from the infeed reel (5); a motor (13) for driving to rotate the take-up reel (6); a means for blowing a fluid (11) to the backside surface to the edge portion of the notch (1) to be in direct contact along the full periphery of the notch (1); and a means for oscillating the tape sideways.
Inventors:
HASEGAWA FUMIHIKO
OOTANI TATSUO
KURODA YASUYOSHI
ICHIKAWA KOICHIRO
INADA YASUO
OOTANI TATSUO
KURODA YASUYOSHI
ICHIKAWA KOICHIRO
INADA YASUO
Application Number:
JP29438793A
Publication Date:
December 02, 1998
Filing Date:
October 29, 1993
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
FUJIKOSHI KIKAI KOGYO KK
FUJIKOSHI KIKAI KOGYO KK
International Classes:
B24B1/04; B24B9/00; B24B9/06; B24B21/00; B24B21/22; H01L21/304; (IPC1-7): B24B9/00; B24B21/00; B24B21/22; H01L21/304
Domestic Patent References:
| JP4364729A | ||||
| JP59110546A | ||||
| JP523963A | ||||
| JP3228562A | ||||
| JP3130353U | ||||
| JP6456952U |
Attorney, Agent or Firm:
Yoshio Arafune