Title:
HIGH FREQUENCY VINYL RESIN PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JPH0639848
Kind Code:
A
Abstract:
PURPOSE: To provide the title apparatus inexpensively performing welding or molding in a definite state without requiring skill.
CONSTITUTION: A high frequency vinyl resin processing apparatus is equipped with the meter relay 3 inserted in the anode current circuit of the high frequency triode of a high frequency oscillator 1, the timer 6 operated by the meter relay 3 inserted in the commercial power supply circuit 4 of the high frequency oscillator 1 in parallel and a device opening the commercial power supply circuit 4 by the timer 6.
Inventors:
TAKEUCHI YASUMITSU
Application Number:
JP21657292A
Publication Date:
February 15, 1994
Filing Date:
July 23, 1992
Export Citation:
Assignee:
TAKEUCHI YASUMITSU
International Classes:
B29C35/12; B29C35/02; B29C65/32; (IPC1-7): B29C35/12; B29C65/32
Domestic Patent References:
| JPS5188574A | 1976-08-03 |
Attorney, Agent or Firm:
Katsunari Nakamura (1 person outside)
Next Patent: POST-CURING APPARATUS