PURPOSE: To obtain a mounted structure of a soldered joint part of a balum and a bridge circuit part and a manufacture thereof by improving directivity characteristic at a superhigh frequency band to upgrade detection performance in a directional bridge circuit built into a network analyzer or the like.

CONSTITUTION: An Au ribbon 2 made longer than an Au pattern A5 on a thin film substrate A3 is bonded on the Au pattern A5. Then, the end part of the Au ribbon 2 on the side of a thin film resistance R220 is lifted to form a part playing a role of a solder dam 16. Then, a semi-rigid cable 30 is placed on a solder B13 being lowered toward a thin film substrate B4 from above. Finally, a fixed amount of the solder C14 is placed with a dispenser 1 or the like.