Title:
【発明の名称】ワイヤボンディング装置
Document Type and Number:
Japanese Patent JP2618279
Kind Code:
B2
Abstract:
PURPOSE:To reduce the impact of bonding and provide an appropriate bonding force by inserting an elastic member between a bonding arm and an independently swinging drive arm. CONSTITUTION:A drive arm 10 is connected to a shaft 11 provided on a member that is movable in an x-y plane. When driven by drive means 8, the drive arm 10 swings independent of a bonding arm 4. An elastic member 7 is provided between the bonding arm 4 and the drive arm 10, so that the driving force may not be transmitted directly to the bonding arm. Therefore, the force will not cause an impact on the tip of a bonding tool 2, while it is absorbed in the elastic member 7. As a result, cracks in the semiconductor pallet are prevented.
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Inventors:
Katsuro Yanagita
Application Number:
JP6725790A
Publication Date:
June 11, 1997
Filing Date:
March 19, 1990
Export Citation:
Assignee:
Kaijo Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP59181027A | ||||
| JP5068059A | ||||
| JP369129A | ||||
| JP6262441U | ||||
| JP57108335U |
Attorney, Agent or Firm:
Shoji Hagiri