COPPER CLAD LAMINATE FOR PRINTED WIRING BOARD EXCELLENT IN HEAT DISSIPATION PROPERTIES AND PRODUCTION THEREOF

Title:

COPPER CLAD LAMINATE FOR PRINTED WIRING BOARD EXCELLENT IN HEAT DISSIPATION PROPERTIES AND PRODUCTION THEREOF

Document Type and Number:

Japanese Patent JPH06104543

Kind Code:

A

Abstract:

PURPOSE: To provide a copper clad laminate for printed wiring board excellent in heat dissipation properties and strength.

CONSTITUTION: The copper clad laminate for printed wiring board comprises a surface copper foil, a central dielectric resin layer, and a thin plate of iron/ copper alloy containing 20-90wt.% Cu, 0.3-11wt.% Al, 0.05-3.0wt.% Mn, 0.005-3.5wt.% Ti, 0.1-12wt.% Cr, 0.001-1.5wt.% Mo, and the remainder of mainly Fe. The alloy is melted and casted and then hot rolled into a metallic plate of 1.0-8mm thick. It is then cold rolled at draft of 50-95%, annealed at 450-1000°C, quenched at a rate of 0.05-5000°C/min, subjected to secondary coil rolling at draft of 5-85%, further subjected to aging at 150-650°C to form a base, onto which the dielectric resin layer and the copper foil are laminated to constitute a copper clad laminate for printed wiring board.

Inventors:

NISHIMURA SATORU
SHIODA KOSAKU
ONO TAKAHIDE
ENDO MICHIO

Application Number:

JP25306292A

Publication Date:

April 15, 1994

Filing Date:

September 22, 1992

Export Citation:

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Assignee:

NIPPON STEEL CORP

International Classes:

B32B15/08; C21D8/02; C22C9/00; C22C38/00; C22C38/28; C22F1/00; C22F1/08; C23C28/00; H05K1/05; (IPC1-7): H05K1/05; B32B15/08; C21D8/02; C22C9/00; C22C38/00; C22C38/28; C22F1/08; C23C28/00

Attorney, Agent or Firm:

Aoki Akira (4 outside)

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