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Title:
【発明の名称】半導体材料を堆積する装置及び方法
Document Type and Number:
Japanese Patent JP3504613
Kind Code:
B2
Abstract:
Apparatus (12, 12a) and a method for depositing a semiconductor material on a glass sheet substrate (G) utilizes a distributor (22) including a heated permeable member (24) through which a carrier gas and a semiconductor material are passed to provide a vapor that is deposited as a semiconductor layer on the conveyed glass sheet substrate. The permeable member (24) is tubular and has an electrical voltage applied along its length to provide the heating, and the carrier gas and the semiconductor as a powder are introduced into the tubular permeable member for flow outwardly therefrom as the vapor. A shroud (34) extending around the tubular permeable member (24) has an opening (36) through which the vapor flows for the semiconductor layer deposition. In one embodiment of apparatus (12), the semiconductor layer is deposited on an upwardly facing surface (56) of the glass sheet substrate (G) while another embodiment of the apparatus (12a) deposits the semiconductor layer on a downwardly facing surface (54) of the substrate.

Inventors:
Powell Ricky Sea
Doller Gary El
Writer Nicholas A
McMaster Harold A
Cox stephen em
Kale terance dee
Application Number:
JP2000532572A
Publication Date:
March 08, 2004
Filing Date:
January 20, 1999
Export Citation:
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Assignee:
First Solar Limited Liability Company
International Classes:
C23C16/453; C03C17/00; C03C17/22; C23C14/24; C23C14/56; H01L21/363; H01L21/365; (IPC1-7): H01L21/363
Domestic Patent References:
JP10204624A
JP6295863A
JP5186864A
JP5239627A
JP7508138A
Attorney, Agent or Firm:
Minoru Nakamura (9 outside)



 
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