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Patent Searching and Data


Title:
METHOD FOR MOLDING HEAT-RESISTANT POLYMER
Document Type and Number:
Japanese Patent JPS5819356
Kind Code:
A
Abstract:

PURPOSE: To melt-mold an arom. polyamide under mild conditions, by adding a high-boiling arom. compd. to an amorphous arom. polyamide.

CONSTITUTION: 0.1W40pts.wt. high-boiling arom. compd. having a b.p. of 200°C or higher such as β-naphthol is added to 100pts.wt. amorphous arom. polyamide having a glass transition point of 150W400°C, an inherent viscosity of 0.5W3 and a repeating unit of the formula wherein Ar, is an arom. group, a heterocyclic group or a bivalent group composed of these groups in combination (these groups may be substituted with alkyl, cycloalkyl, aryl, alkoxy or halogen); two carbonyl groups attached to Ar1 are bonded to different two carbon atoms of Ar1; Ar2 is the same as Ar1, and Ar1, Ar2 may be the same or different groups; two N atoms attached to Ar2 are bonded to different two carbon atoms of Ar2. The mixture is molten by heating it, and extruded or compression-molded.


Inventors:
OOSAWA MASANORI
KAWAMATA MOTOO
TOYODA TOSHIHIRO
BABA KENICHI
Application Number:
JP11703481A
Publication Date:
February 04, 1983
Filing Date:
July 28, 1981
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08L77/00; C08J5/00; C08K5/01; C08L77/10; (IPC1-7): C08K5/01; C08L77/10
Attorney, Agent or Firm:
Wakabayashi Tadashi