Title:
【発明の名称】電子部品搬送体の底材およびその製造方法
Document Type and Number:
Japanese Patent JP2819151
Kind Code:
B2
Inventors:
Kuramochi Sadao
Junichi Hashikawa
Hideto Akiba
Hyakudome
Junichi Hashikawa
Hideto Akiba
Hyakudome
Application Number:
JP14263789A
Publication Date:
October 30, 1998
Filing Date:
June 05, 1989
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65D85/86; B65B15/04; B65B47/06; B65D73/02; B65D85/38; (IPC1-7): B65B47/06; B65B15/04; B65D73/02; B65D85/86
Domestic Patent References:
| JP5538287A | ||||
| JP62193915A |
Attorney, Agent or Firm:
Atsumi Konishi