PURPOSE: An electroconductive resin paste excellent in workability, reliability, etc., and suitable as a mounting resin, obtained by mixing a specified epoxy resin with a curing agent, a cure accelerator comprising a tert. amine salt, a solvent and silver powder.
CONSTITUTION: The purpose electromagnetic resin paste is prepared by mixing a liquid epoxy resin (e.g., phloroglucinol triglycidyl ether) having a hydrolyzable halogen group content ≤600ppm and at least 2.5 epoxy groups per molecule with a curing agent having at least 2.5 active hydrogen atoms molecule (e.g., a precondensate of phenol with acrolein, or pyromellitic anhydride), a cure accelerator comprising a tert. amine salt (e.g., a salt of dimethylbenzylamine with phthalic acid), a solvent (e.g., Cellosolve) and silver powder. This paste can be used suitably for sealing semiconductor elements.
OKABE YUKIHIRO
NAKATSUKA RIYUUZOU
