Title:
【発明の名称】プリント配線基板の製造に有用な硬化性組成物
Document Type and Number:
Japanese Patent JPH0617442
Kind Code:
B2
Abstract:
Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
Inventors:
ERITSUKU UIRUHERUMU WARESU
JON HENRII RUPINSUKII
MAAKU MARUKOBIZU
ROBAATO EDOGAA KORUBOON
JEEMUZU ROBAATO PURESUREI
MAIKERU JON DEBISU
MAIKERU JERARUDO MINITSUKU
SUTEIIBUN JOSEFU KUBISEN JUNIA
JON EDO
JON HENRII RUPINSUKII
MAAKU MARUKOBIZU
ROBAATO EDOGAA KORUBOON
JEEMUZU ROBAATO PURESUREI
MAIKERU JON DEBISU
MAIKERU JERARUDO MINITSUKU
SUTEIIBUN JOSEFU KUBISEN JUNIA
JON EDO
Application Number:
JP18069189A
Publication Date:
March 09, 1994
Filing Date:
July 14, 1989
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
C08G59/00; C08G59/06; C08G59/14; C08G59/38; C08G59/50; C08G59/56; C08G59/62; C08K3/22; C08G59/68; C08L61/10; C08L63/00; C08L71/12; D01F11/12; H01B1/04; H05K1/03; (IPC1-7): C08G59/14; C08G59/50; C08G59/62; C08G59/68; C08K3/22; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Tokunji Ikunuma