Title:
【発明の名称】のこ盤における長尺材料のハンドリング装置
Document Type and Number:
Japanese Patent JP2840712
Kind Code:
B2
Abstract:
To provide for efficient handling of stock material (40) and cut-off elements (41), which may be workpieces or cut-off wedges, by a cut-off saw, with miter adjustments, a positioning finger (21) is pressed against the stock material to engage the stock material against a guide plate or bar (19) prior to clamping the stock material in position for cut-off. After cutting of the stock material, the clamp (5) is released, and the finger is moved to a position ahead of the cut-off surface, and then longitudinally in feeding direction to a removal conveyor (28) so that the cut-off element is raked away by the positioning finger. After removal, the positioning finger is retracted out of the path of the stock material and, while new stock material is being fed, is longitudinally returned to the starting position to again align new stock material against the guide plate or bar (19).
Inventors:
ARUMIN SHUTORUTSUAA
Application Number:
JP21990090A
Publication Date:
December 24, 1998
Filing Date:
August 20, 1990
Export Citation:
Assignee:
KOIRO BEJITSUTSU GMBH UNTO CO EE DEE FUAU DEIINSUTORAISUTSUNGUSU KG
International Classes:
B23D45/06; B23D47/04; B23D59/00; B23Q7/04; (IPC1-7): B23D47/04; B23D45/06
Domestic Patent References:
| JP63185517A | ||||
| JP5239519B2 |
Attorney, Agent or Firm:
Shuichiro Kitamura