Title:
【発明の名称】対象物体を握持または切断するためのデバイス
Document Type and Number:
Japanese Patent JPH04507363
Kind Code:
A
Abstract:
A device for grasping or cutting an object has at least two elongate elements (1, 3), preferably two elongate elements, at least a portion of at least one of the elements is formed from a pseudoelastic material, preferable a shape memory alloy. End portions (7) of the elements (1, 3) can be moved away from one another and then toward one another to grasp or cut an object between the elements. In certain embodiments, the device further comprises an actuating means and at least a portion of the elements and/or the actuating means is formed from a pseudoelastic material. The device is particularly useful in grasping or cutting objects located in difficult to reach areas, for example within the body during surgery.
Inventors:
Middleman, Lee M
Pica, Walter Earl
Pica, Walter Earl
Application Number:
JP51297790A
Publication Date:
December 24, 1992
Filing Date:
August 16, 1990
Export Citation:
Assignee:
Medtronic Incorporated
International Classes:
A61B10/00; A61B10/02; A61B17/02; A61B10/06; A61B17/04; A61B17/08; A61B17/10; A61B17/12; A61B17/22; A61B17/28; A61B17/32; A61B17/3201; B25B9/00; B25J1/00; B25J15/08; B26B13/00; B26B13/26; A61B17/00; A61B17/06; A61B17/30; A61B17/34; A61B18/14; A61F2/00; (IPC1-7): A61B10/00; A61B17/22; A61B17/28; A61B17/32
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)