Title:
【発明の名称】電気的相互接続部材、相互接続方法、及び電気的相互接続回路とその製造方法
Document Type and Number:
Japanese Patent JP2950831
Kind Code:
B2
Abstract:
Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member (10) between the flex circuit and printhead, with the lead frame member (10) having plurality of conductive leads or fingers (14) extending at a predetermined angle (-) with respect to the final plane of interconnection. During the interconnection process, these leads or fingers (14) are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame (10) in a single plane of interconnection.
Inventors:
JANETSUTO II MIIBAN
ROORENSU DABURYUU CHAAN
DEYUON TON RAA
RUUBEN NEBARETSU
ROORENSU DABURYUU CHAAN
DEYUON TON RAA
RUUBEN NEBARETSU
Application Number:
JP8704688A
Publication Date:
September 20, 1999
Filing Date:
April 08, 1988
Export Citation:
Assignee:
HYUURETSUTO PATSUKAADO CO
International Classes:
B41J2/05; B41J2/01; B41J2/14; B41J2/16; B41J29/00; H01R11/01; H01R29/00; H01R33/76; H05K3/40; H05K1/09; (IPC1-7): B41J2/05; B41J2/01; B41J2/16; H01R11/01; H01R33/76
Domestic Patent References:
| JP5838966U | ||||
| JP5741268U | ||||
| JP63501415A |
Foreign References:
| US4635073A |
Attorney, Agent or Firm:
Hideo Ueno