Title:
【発明の名称】均一メッキ処理を可能にした電気メッキ処理システム
Document Type and Number:
Japanese Patent JP3065970
Kind Code:
B2
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| WO/2012/132577 | COPPER FOIL FOR PRINTED CIRCUIT |
Inventors:
Masatsugu Nagakura
Application Number:
JP23916697A
Publication Date:
July 17, 2000
Filing Date:
August 21, 1997
Export Citation:
Assignee:
Marunaka Industry Co., Ltd.
International Classes:
C25D7/06; C25D17/06; C25D17/08; C25D17/10; H05K3/24; (IPC1-7): C25D17/06; C25D7/06; C25D17/08; C25D17/10
Attorney, Agent or Firm:
Toshiaki Suzuki