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Patent Searching and Data


Title:
PATTERN INSPECTION
Document Type and Number:
Japanese Patent JPS5833835
Kind Code:
A
Abstract:
PURPOSE:To enhance the yield of wafers in order to detect defects of pattern based on existing of the angled portions of the one or both patterns by comparing both patterns. CONSTITUTION:The window A1 shown in Fig. A is not covered with the pattern P3, while the window B1 is covered entirely with the pattern P3. In the case of Fig. B, the window A1 is not covered with the pattern P4, while the window B2 is partly covered with the pattern P4. Namely, in the case of Fig. A, the normal angled portion exists but in the case of B, the window B2 is partly covered because the angled portion of pattern P4 is partly disappearing. Therefore, it is not a normal angled portion and accordingly the pattern P4 is judged to be defective.

Inventors:
NAKAGAWA KIYOSHI
KAWASHIMA HIDEAKI
Application Number:
JP13152981A
Publication Date:
February 28, 1983
Filing Date:
August 24, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G01N21/88; G01N21/93; G01N21/956; G03F1/84; H01L21/027; H01L21/30; H01L21/66; (IPC1-7): H01L21/30
Domestic Patent References:
JPS53117978A1978-10-14
JPS50131469A1975-10-17
JPS5690373A1981-07-22
JPS6239813A1987-02-20
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)