Title:
【発明の名称】放熱装置及びヒートシンクの組立体を備える高性能の放熱実装体
Document Type and Number:
Japanese Patent JPH08507412
Kind Code:
A
Abstract:
A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.
Inventors:
Chia, Chok Jay
Aragara Tonam, Manian
Lowe, Kwai Hoon
Rim, Sen Soi
Aragara Tonam, Manian
Lowe, Kwai Hoon
Rim, Sen Soi
Application Number:
JP51914794A
Publication Date:
August 06, 1996
Filing Date:
February 16, 1994
Export Citation:
Assignee:
LSI Logic Corporation
International Classes:
F02F7/00; H01L23/367; H01L23/40; (IPC1-7): H01L23/40
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)