Title:
WAFER CONVEYER
Document Type and Number:
Japanese Patent JPS593944
Kind Code:
A
Abstract:
PURPOSE:To fix the positions of wafers during conveyance, and to enable automation of positioning and provision of dustproof means for every wafers by a method wherein wafer sucking structure to suck the wafers mounted on supporters from the mounting face side according to vacuum sucking force and to fix on the supporters is prepared. CONSTITUTION:A vacuum path 5 is provided penetrating a conveyance base 1 and a supporter 2, and an air chamber 6 consisting of an elastic body of rubber, etc., is provided at the tip. Air pressure 6 is compressed once, vacuum sucking force is generated through the vacuum path 5 according to reset force of the air chamber when pressure thereof is released, and the wafer 3 is sucked from the lower side to be fixed on the supporter 2. A guide 7 is protrudingly provided to the conveyance base 1, and an engaging guide receptacle 9 is provided to an outside processor 8. By arranging and fixing the wafer 3 making to come in contact with the referential face 10 of the supporter 2, when the guide receptacles 9 are formed at the fixed referential position at the respective processors, by inserting the guide 7 of the wafer conveyance base 1 into the guide receptacle 9, the wafers 3 are positioned to the fixed positions at the respective processors.
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Inventors:
KOBAYASHI AKIRA
Application Number:
JP11063782A
Publication Date:
January 10, 1984
Filing Date:
June 29, 1982
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/677; H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Aoki Akira
Next Patent: SUCTION DEVICE FOR WAFER